FSC-5998: Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware

Documents

• MIL-P-13949/21 – PLASTIC SHEET, LAMINATED, MATERIALS (FOR PRINTED WIRING BOARDS), BASE MATERIAL, AI, ARAMID, WOVEN, MAJORITY POLYIMIDE, RESIN PREIMPREGNATED (B-STAGE) (NO S/S DOCUMENT)
• MIL-P-46843 – PRINTED WIRING ASSEMBLIES, PRODUCTION OF (NO S/S DOCUMENT)
• MIL-PRF-31032 – Printed Circuit Board/Printed Wiring Board, General Specification for
• MIL-PRF-31032/1 – Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or Without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
• MIL-PRF-31032/2 – Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or Without Plated-Through Holes, for Soldered Part Mounting
• MIL-PRF-31032/3 – Printed Wiring Board, Flexible, Single and Double Layer, with or Without Plated-Through Holes, with or Without Stiffeners, for Soldered Part Mounting
• MIL-PRF-31032/4 – Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
• MIL-PRF-31032/5 – Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated-Through Holes, for High Frequency Applications
• MIL-PRF-31032/6 – Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic or Thermosetting Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
• MIL-PRF-50884 – Printed Wiring Board, Flexible or Rigid-Flex, General Specification for
• MIL-PRF-55110 – Printed Wiring Board, Rigid, General Specification for
• MIL-S-13949 – SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (NO S/S DOCUMENT)
• MIL-S-13949/10 – SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
• MIL-S-13949/11 – SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (NO S/S DOCUMENT)
• MIL-S-13949/12 – SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT) (NO S/S DOCUMENT)
• MIL-S-13949/13 – SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (NO S/S DOCUMENT)
• MIL-S-13949/15 – SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
• MIL-S-13949/16 – SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (NO S/S DOCUMENT)
• MIL-S-13949/18 – SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GH (WOVEN E-GLASS REINFORCEMENT, MAJORITY POLYFUNCTIONAL EPOXY RESIN, HOT STRENGTH RETENTION, FLAME RESISTANT) (NO S/S DOCUMENT)
• MIL-S-13949/19 – SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
• MIL-S-13949/2 – Sheet, Printed Wiring Board, Laminated, Base Material GB (Woven E-Glass Reinforcement, Majority Polyfunctional Epoxy Resin, Hot Strength Retention, Metal Clad or Unclad) (No S/S Document)
• MIL-S-13949/20 – SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (NO S/S DOCUMENT)
• MIL-S-13949/22 – SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
• MIL-S-13949/23 – SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (NO S/S DOCUMENT)
• MIL-S-13949/24 – SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEMIDE MODIFIED EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
• MIL-S-13949/25 – SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL CF (NONWOVEN POLYESTER, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
• MIL-S-13949/26 – Sheet, Printed Wiring Board, Prepreg, Base Material GM (Woven E-Glass Reinforcement, Triazine and or Bismaleimide Modified Epoxy Resin) (No S/S Document)
• MIL-S-13949/27 – SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL SC (WOVEN S-2 GLASS FIBER REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
• MIL-S-13949/28 – SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL SC (WOVEN S-2 GLASS FIBER REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT) (NO S/S DOCUMENT)
• MIL-S-13949/29 – SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
• MIL-S-13949/30 – SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT) (NO S/S DOCUMENT)
• MIL-S-13949/31 – SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
• MIL-S-13949/32 – SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, FLAME RESISTANT) (NO S/S DOCUMENT)
• MIL-S-13949/4 – SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
• MIL-S-13949/5 – SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GH (WOVEN E-GLASS REINFORCEMENT, MAJORITY POLYFUNCTIONAL EPOXY RESIN, HOT STRENGTH RETENTION, FLAME RESISTANT, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
• MIL-STD-1861 – ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE, SELECTION AND USE OF (S/S BY MIL-HDBK-1861)
• MIL-STD-2118 – Flexible and Rigid Flex Printed Wiring for Electronic Equipment Design Requirements for (S/S by IPC2221 and IPC2223)
• MIL-STD-2119 – Design Requirements for Printed-Wiring Electrical Backplane Assemblies
• MIL-STD-2198 – Design Requirements for Metal Electrical Backplane Assemblies
• MIL-STD-275 – PRINTED WIRING FOR ELECTRONIC EQUIPMENT (REFER TO IPC-D275 OR IPC-2221)
• QML-28870 – Assemblies, Electrical Backplane, Printed-Wiring, General Specification for (Replaced by the Qualified Products Database (QPD) See Notice 1 for Additional Information)
• QML-31032 – Printed Circuit Board/Printed Wiring Board, General Specification for (Replaced by the Qualified Products Database (QPD) see Notice 1 for Additional Information)
• QPL-13949 – SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (NO S/S DOCUMENT)
• QPL-28870 – ASSEMBLIES, ELECTRICAL BACKPLANE, PRINTED-WIRING, GENERAL SPECIFICATION FOR (NO S/S DOCUMENT)
• QPL-50884 – Printed Wiring Board, Flexible or Rigid-FLex, General Specification for(Replaced by the Qualified Products Database (QPD) see Notice 1 for Additional Information)
• QPL-55110 – Printed Wiring Board, Rigid, General Specification for (Replaced by the Qualified Products Database (QPD) see Notice 1 for Additional Information)
• UL796 – Boards, Printed-Wiring