MIL-PRF-31032/2

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or Without Plated-Through Holes, for Soldered Part Mounting

Designation	MIL-PRF-31032/2
Status	Active
Last Update	None
Last Document Update	2025-03-10
Publisher	Defense Standardization Program Office

Version	Date	Distribution Statement	Access	Pages
Revision E	2025-03-10	A	Public	27
Revision D Amendment 2 (all previous amendments incorporated)	2024-05-02	A	Public	27
Revision D Amendment 1 (amendment incorporated)	2022-07-22	A	Public	27
Revision D	2020-03-02	A	Public	27
Revision C Amendment 1 (amendment incorporated)	2018-06-12	A	Public	26
Revision C	2017-06-02	A	Public	26
Revision B Amendment 1 (amendment incorporated)	2012-11-02	A	Public	25
Revision B	2010-06-14	A	Public	25
Revision A Amendment 4 (all previous amendments incorporated)	2009-07-04	A	Public	18
Revision A Amendment 3 (all previous amendments incorporated)	2008-04-23	A	Public	17
Revision A Amendment 2 (all previous amendments incorporated)	2006-10-31	A	Public	16
Revision A Amendment 1 (amendment incorporated)	2006-02-24	A	Public	16
Revision A	2004-10-29	A	Public	14
Base Document	1996-10-31	A	Public	10

Service	Organization	Code
Lead Standardization Activity	DLA Land and Maritime	CC
Preparing Activity	DLA Land and Maritime	CC
Air Force	Air Force Life Cycle Management Center - Electronic Components, Wire and Cable	85
Army	US Army Combat Capabilities Development Command, C5ISR Center	CR
DLA	DLA Land and Maritime	CC
Navy	Naval Information Warfare Systems Command	EC