FSC-5998: Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware
Documents
- IPC-QL653 – Facilities that Inspect/Test Printed Boards, Components, and Materials, Qualification of
- IPC-SG141 – Fabric, Finished, Woven from "S" Glass for Printed Boards
- IPC-SM840 – Solder Mask, Permanent, Qualification and Performance Specification of
- IPC-T50 – Circuits, Interconnecting and Packaging Electronic, Terms and Definitions
- IPC-TM650.2.1.1 – Microsectioning, Manual Method
- IPC-TM650.2.1.1.2 – Microsectioning-Semi or Automatic Technique Microsection Equipment (Alternate)
- IPC-TM650.2.1.10 – Visual Inspection for Dicyandiamide Crystals (No S/S Document)
- IPC-TM650.2.1.5 – Surface Examination, Unclad and Metal-Clad Material
- IPC-TM650.2.1.7 – Thread Count, Glass Fibers, Prepreg (No S/S Document)
- IPC-TM650.2.1.8 – Workmanship
- IPC-TM650.2.1.9 – Surface Scratch Examination Metal Clad Foil
- IPC-TM650.2.2.1 – Mechanical Dimensional Verification
- IPC-TM650.2.2.18 – Laminates by Mechanical Measurement, Determination of Thickness
- IPC-TM650.2.2.18.1 – Laminates, Metallic Clad, Thickness, Determination of Cross-sectional
- IPC-TM650.2.2.2 – Optical Dimensional Verification
- IPC-TM650.2.2.5 – Microsections, Dimensional Inspections Using
- IPC-TM650.2.2.6 – Hole Size Measurement, Drilled
- IPC-TM650.2.2.7 – Hole Size Measurement, Plated
- IPC-TM650.2.3.1.1 – Chemical Cleaning of Metal Clad Laminate (No S/S Document)
- IPC-TM650.2.3.10 – Flammability of Laminate
- IPC-TM650.2.3.12 – GLASS FABRIC WEIGHT (NO S/S DOCUMENT)
- IPC-TM650.2.3.15 – Purity, Copper Foil or Plating
- IPC-TM650.2.3.16 – Resin Content of Prepreg, By Burn-Off
- IPC-TM650.2.3.16.1 – Resin Content of Prepreg Material (Treated Weight)
- IPC-TM650.2.3.17 – Resin Flow of Prepreg Materials (B-Stage) (No S/S Document)
- IPC-TM650.2.3.17.2 – Resin Flow "No Flow" Prepreg (No S/S Document)
- IPC-TM650.2.3.18 – Resin Gel Stroke Time for Pregreg Materials (No S/S Document)
- IPC-TM650.2.3.19 – Volatile Content of Prepreg (No S/S Document)
- IPC-TM650.2.3.25 – Surface, Ionizable, Contaminants by Resistivity of Solvent Extract (Rose), Detection and Measurement of
- IPC-TM650.2.3.25.1 – Ionic Cleanliness Testing of Bare PWBs
- IPC-TM650.2.3.38 – Surface Organic Contaminant Detection Test
- IPC-TM650.2.3.39 – Surface Organic Contaminant Identification Test (Infrared Analytical Method)
- IPC-TM650.2.3.4 – Chemical Resistance, Marking Paints and Inks
- IPC-TM650.2.3.4.2 – Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure (No S/S Document)
- IPC-TM650.2.3.4.3 – Chemical Resistance of Core Materials to Methylene Chloride (No S/S Document)
- IPC-TM650.2.3.7.1 – Cupric Chloride Etching Method (No S/S Document)
- IPC-TM650.2.3.9 – Flammability of Prepreg and Thin Laminate (No S/S Document)
- IPC-TM650.2.4.1 – Adhesion, Tape Testing
- IPC-TM650.2.4.1.1 – Adhesion, Marking Paints and Ink
- IPC-TM650.2.4.15 – Surface Finish, Metal Foil
- IPC-TM650.2.4.18.1 – Tensile Strength and Elongation, In-House Plating
- IPC-TM650.2.4.20 – Terminal Bond Strength, Flexible Printed Wiring
- IPC-TM650.2.4.21 – Land and Bond Strength, Unsupported Component Hole
- IPC-TM650.2.4.22 – Bow and Twist (Percentage)
- IPC-TM650.2.4.24 – Glass Transition Temperature ANS Z-Axis Thermal Expansion by TMA (No S/S Document)
- IPC-TM650.2.4.24.1 – Time to Delamination
- IPC-TM650.2.4.25 – Glass Transition Temperature and Cure Factor by DSC (No S/S Document)
- IPC-TM650.2.4.28 – Adhesion, Solder Mask (Non-Melting Metals)
- IPC-TM650.2.4.28.1 – Adhesion, Solder Resist (Mask) Tape Test Method
- IPC-TM650.2.4.3 – Flexural Endurance, Flexible Printed Wiring Materials
- IPC-TM650.2.4.3.1 – Flexural Fatigue and Ductility, Flexible Printed Wiring
- IPC-TM650.2.4.36 – Rework Simulation, Plated-Through Holes for Leaded Components
- IPC-TM650.2.4.38 – Prepreg Scaled Flow Testing (No S/S Document)
- IPC-TM650.2.4.39 – Dimensional Stability, Glass Reinforced Thin Laminates (No S/S Document)
- IPC-TM650.2.4.4 – Laminates, Flexural Strength of (at Ambient Temperature) (No S/S Document)
- IPC-TM650.2.4.4.1 – Flexural Strength of Laminates (at Elevated Temperature) (No S/S Document)
- IPC-TM650.2.4.41 – Coefficient of Linear Thermal Expansion of Electrical Insulating Materials (No S/S Document)
- IPC-TM650.2.4.41.1 – Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method (No S/S Document)
- IPC-TM650.2.4.41.2 – Expansion, Thermal, Coefficient of - Strain Gage Method
- IPC-TM650.2.4.8 – Laminates, Metallic Clad, Peel Strength of
- IPC-TM650.2.4.8.2 – Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method) (No S/S Document)
- IPC-TM650.2.5.1 – Arc Resistance of Printed Wiring Material (No S/S Document)
- IPC-TM650.2.5.17.1 – Volume and Surface Resistivity of Dielectric Materials (No S/S Document)
- IPC-TM650.2.5.28 – Flexible Printed Wiring Materials & Resonance
- IPC-TM650.2.5.5.2 – Wiring Board Material - Clip Method, Dielectric Constant and Dissipation Factor of Printed (No S/S Document)
- IPC-TM650.2.5.5.3 – Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)
- IPC-TM650.2.5.5.5 – Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band
- IPC-TM650.2.5.5.7 – CHARACTERISTIC IMPEDANCE OF LINES ON PRINTED BOARDS BY TDR
- IPC-TM650.2.5.6 – Dielectric Breakdown of Rigid Printed Wiring Material (No S/S Document)
- IPC-TM650.2.5.6.2 – Electric Strength of Printed Wiring Material (No S/S Document)
- IPC-TM650.2.5.7 – Dielectric Withstanding Voltage, PCB
- IPC-TM650.2.6.1 – Fungus Resistance Printed Wiring Materials
- IPC-TM650.2.6.10 – X-Ray (Radiography), Multilayer Printed Wiring Printed Board Test Methods
- IPC-TM650.2.6.17 – Hydrolitic Stability, Flexible Printed Wiring (No S/S Document)
- IPC-TM650.2.6.2.1 – Water Absorption, Metal Clad Plastic Laminates (No S/S Document)
- IPC-TM650.2.6.26 – DC Current Induced Thermal Cycling
- IPC-TM650.2.6.3 – Printed Boards, Moisture and Insulation Resistance
- IPC-TM650.2.6.4 – Outgassing, Printed Boards
- IPC-TM650.2.6.5 – Physical Shock, Multilayer Printed Wiring
- IPC-TM650.2.6.7 – Thermal Shock and Continuity, Printed Board
- IPC-TM650.2.6.7.2 – Thermal Shock, Continuity and Microsection, Printed Board
- IPC-TM650.2.6.8 – Thermal Stress, Plated-Through Holes
- J-STD-003 – Solderability Tests for Printed Boards
- MIL-A-24741 – Assemblies, Metal electrical Backplane, One and Two Layer, General Specification for
- MIL-A-28870 – Assemblies, Electrical Backplane, Printed-Wiring, General Specification for
- MIL-C-28809 – Circuit Card Assemblies, Rigid, Flexible, And Rigid Flex (No S/S Document)
- MIL-C-71042 – Circuit Card Assembly, Logic: 11784523
- MIL-C-71043 – Circuit Card Assembly, Amplifier: 11784526
- MIL-DTL-32449 – Spider Transceiver Module
- MIL-DTL-32462 – Spider Munition Control Electronics Assembly
- MIL-DTL-32463 – Spider Munition Control Electronics Assembly Trainer
- MIL-DTL-62736 – Printed Wiring Assembly, I/O
- MIL-DTL-62737 – Printed Wiring Assembly, Computer
- MIL-DTL-62738 – Printed Wiring Assembly, Ignition Interrupt Driver
- MIL-DTL-62739 – Printed Wiring Assembly, Clock/Display Driver
- MIL-DTL-62740 – Printed Wiring Assembly, Special Circuits
- MIL-DTL-62741 – Printed Wiring Assembly, MUX/ADCON
- MIL-F-8261 – Fungus resistance Tests, Aeronautical and Associated Materials, General Specification for (No S/S Document)
- MIL-HDBK-1861 – Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware
- MIL-P-13949/17 – PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL AI, ARAMID FABRIC WOVEN, POLYIMIDE RESIN, COPPER-CLAD (NO S/S DOCUMENT)