Guidelines for using Plastic Encapsulated Microcircuits and Semiconductors in Military Aerospace and other Rugged Applications

General Information

Designation	TECHAMERICA-GEIA-SSB1
Status	Withdrawn
Last Update	2021-08-09
Last Document Update	None
Publisher	Defense Standardization Program Office

Categories

FSG-01

FSC-59GP

Document Category

TechAmerica

History

Version	Date	Distribution Statement	Access	Pages
Notice - Withdrawal	2021-05-19	A	Public	1
Notice - Adoption, Tier 2	2011-06-17	A	Public	1

Responsibilities

Service	Organization	Code
Lead Standardization Activity	DLA Land and Maritime	CC
Preparing Activity	DLA Land and Maritime	CC
DLA	DLA Land and Maritime	CC