Association Connecting Electronics Industry

Documents

• IPC-1782 – Standard for Manufacturing and Supply Chain Traceability of Electronic Products
• IPC-1782B – Standard for Manufacturing and Supply Chain Traceability of Electronic Products
• IPC-1791 – Trusted Electronic Designer, Fabricator and Assembler Requirements
• IPC-2141 – Circuit Boards, Design Guide for High-Speed Controlled Impedance
• IPC-2152 – Design Standard for Determining Current-Carrying Capacity in Printed Board Design
• IPC-2221 – Printed Board Design Generic Standard on
• IPC-2223 – Flexible Printed Boards, Sectional Design Standard for
• IPC-2226 – Boards, Printed, Sectional Design Standard for High Density Interconnect (HD)
• IPC-2251 – Design Guide for the Packaging of High Speed Electronic Circuits
• IPC-2615 – Printed Board Dimensions and Tolerances
• IPC-4202 – Base, Flexible, Dielectrics for Use in Flexible Printed Circuitry
• IPC-4203 – Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
• IPC-4204 – Metal-Clad, Flexible, Dielectrics for Use in Fabrication of Flexible Printed Circuitry
• IPC-4412 – Fabric, Finished, Woven from E Glass for Printed Boards
• IPC-4562 – Metal Foil for Printed Wiring Applications
• IPC7711-21 – Rework, Modification and Repair of Electronic Assemblies
• IPC-9191 – Statistical Process Control (SPC), Implementation of
• IPC-9252 – Electrical Testing of Unpopulated Printed Boards, Requirements for
• IPC-A142 – Finished Fabric Woven from Aramid for Printed Boards, Specification for (No S/S Document)
• IPC-A41 – BOARDS, PRINTED, SINGLE SIDED (NO S/S DOCUMENT)
• IPC-A42 – BOARDS, PRINTED, DOUBLE SIDED (NO S/S DOCUMENT)
• IPC-A43 – BOARDS, PRINTED, TEN LAYER MULTILAYER (NO S/S DOCUMENT)
• IPC-A44 – BOARDS, PRINTED, FOUR LAYER MULTILAYER (NO S/S DOCUMENT)
• IPC-A610 – Acceptability of Electronic Assemblies
• IPC-A-610 – Acceptability of Electronic Assemblies
• IPC-CF150 – COPPER FOIL FOR PRINTED WIRING APPLICATIONS (NO S/S DOCUMENT)
• IPC-D275 – Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies (No S/S Document)
• IPC-D322 – Guidelines for Selecting Printed Wiring Board Sizes using Standard Panel Sizes
• IPC-D350 – Printed Board Description in Digital Form
• IPC-D351 – Electronic Design Data Description for Printed Wiring Boards in Digital Form
• IPC-D352 – Printed Board Drawings in Digital Form
• IPC-D356 – Bare Substrate Electrical Test Data Format
• IPC-DW425 – Design and End Product Requirements for Discrete Wiring Boards
• IPC-EG140 – FABRIC, FINISHED, WOVEN FROM "E" GLASS FOR PRINTED BOARDS (NO S/S DOCUMENT)
• IPC-FC231 – DIELECTRICS, FLEXIBLE BASE, FOR USE IN FLEXIBLE PRINTED WIRING (NO S/S DOCUMENT)
• IPC-FC231/1 – DIELECTRIC, FLEXIBLE BASE, (POLYIMIDE) (NO S/S DOCUMENT)
• IPC-FC231/10 – DIELECTRIC, FLEXIBLE BASE (POLYIMIDE-CAST) (NO S/S DOCUMENT)
• IPC-FC231/11 – DIELECTRIC (POLYIMIDE) BASE, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC231/12 – DIELECTRIC (POLYIMIDE) FLEXIBLE BASE (NO S/S DOCUMENT)
• IPC-FC231/13 – DIELECTRIC (PEI) FLEXIBLE, BASE (NO S/S DOCUMENT)
• IPC-FC231/14 – DIELECTRIC (POLYIMIDE) FLEXIBLE BASE (NO S/S DOCUMENT)
• IPC-FC231/2 – DIELECTRIC (FEP), BASE, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC231/3 – DIELECTRIC (POLYIMIDE), BASE, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC231/5 – DIELECTRIC (EPOXY/POLYESTER FIBERS/POLYESTER FILM), BASE, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC231/6 – DIELECTRIC (EPOXY/GLASS/POLYESTER), BASE, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC231/7 – EPOXY,GLASS, FLEXIBLE BASE, DIELECTRIC (NO S/S DOCUMENT)
• IPC-FC231/8 – DIELECTRIC, BASE, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC231/9 – DIELECTRIC, BASE, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC232 – DIELECTRIC FILMS, ADHESIVE COATED, FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS (NO S/S DOCUMENT)
• IPC-FC232/1 – DIELECTRIC, FLEXIBLE ADHESIVE COATED, AND FLEXIBLE ADHESIVE BONDING FILMS (ACRYLIC POLYIMIDE) (NO S/S DOCUMENT)
• IPC-FC232/10 – DIELECTRIC FLEXIBLE ADHESIVE COATED AND FLEXIBLE ADHESIVE BONDING FILMS (ARAMID-ACRYLIC) (NO S/S DOCUMENT)
• IPC-FC232/11 – DIELECTRIC (POLYIMIDE-BUTYRAL: PHENOLIC), ADHESIVE COATED, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC232/12 – DIELECTRIC (POLYIMIDE-NITRILE: PHENOLIC), ADHESIVE COATED, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC232/13 – DIELECTRIC (POLIMIDE-POLYETHERIMIDE), ADHESIVE COATED, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC232/14 – DIELECTRIC (POLIMIDE-ACRYLIC), ADHESIVE COATED, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC232/15 – DIELECTRIC (POLYIMIDE-BUTYRAL: PHENOLIC), ADHESIVE COATED, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC232/16 – DIELECTRIC COATED, FILMS (EPOXY-POLYIMIDE), ADHESIVE BONDING, FLEXIBLE AND FLEXIBLE ADHESIVE (NO S/S DOCUMENT)
• IPC-FC232/17 – FILMS (ACRYLIC-GLASS), ADHESIVE BONDING, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC232/18 – FILMS (ACRYLIC), ADHESIVE BONDING, FLEXIBLE, UNSUPPORTED (NO S/S DOCUMENT)
• IPC-FC232/19 – FILMS (EPOXY), ADHESIVE BOARDING, FLEXIBLE, UNSUPPORTED (NO S/S DOCUMENT)
• IPC-FC232/2 – DIELECTRIC, FLEXIBLE ADHESIVE COATED AND FLEXIBLE ADHESIVE BONDING FILMS (EPOXY POLYIMIDE) (NO S/S DOCUMENT)
• IPC-FC232/20 – FILMS (POLYESTER), ADHESIVE BONDING, FLEXIBLE, UNSUPPORTED (NO S/S DOCUMENT)
• IPC-FC232/21 – DIELECTRIC (POLYIMIDE-POLYIMIDE), FLEXIBLE BONDING (NO S/S DOCUMENT)
• IPC-FC232/3 – DIELECTRIC, FLEXIBLE ADHESIVE COATED (FEP-ACRYLIC) (NO S/S DOCUMENT)
• IPC-FC232/4 – DIELECTRIC (FEP-EPOXY), ADHESIVE COATED, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC232/5 – DIELECTRIC (POLYIMIDE-FEP), ADHESIVE COATED, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC232/6 – DIELECTRIC (FEP-POLYESTER), ADHESIVE COATED, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC232/7 – DIELECTRIC, FLEXIBLE ADHESIVE COATED, AND FLEXIBLE ADHESIVE BONDING FILMS (POLYESTER-POLYESTER) (NO S/S DOCUMENT)
• IPC-FC232/8 – DIELECTRIC (POLYVINYL FLOURIDE-EPOXY), ADHESIVE COATED, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC232/9 – DIELECTRIC (POLYVINYL FLUORIDE-POLYESTER), ADHESIVE COATED, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC233 – FILMS, FLEXIBLE ADHESIVE BONDING (NO S/S DOCUMENT)
• IPC-FC241 – DIELECTRICS, METAL-CLAD FLEXIBLE, FOR USE IN FABRICATION OF FLEXIBLE PRINTED WIRING (NO S/S DOCUMENT)
• IPC-FC241/1 – METAL-CLAD, FLEXIBLE, DIELECTRIC (POLYIMIDE ACRYLIC) (NO S/S DOCUMENT)
• IPC-FC241/10 – METAL-CLAD, FLEXIBLE, DIELECTRIC (POLYIMIDE-BUTYRAL PHENOLIC) (NO S/S DOCUMENT)
• IPC-FC241/11 – METAL-CLAD, FLEXIBLE, DIELECTRIC (CAST POLYIMIDE ADHESIVELESS) (NO S/S DOCUMENT)
• IPC-FC241/12 – METAL-CLAD, FLEXIBLE, DIELECTRIC (PHYSICAL VAPOR DEPOSITED METAL-ADHESIVELESS) (NO S/S DOCUMENT)
• IPC-FC241/13 – METAL-CLAD, FLEXIBLE, DIELECTRIC (POLYIMIDE-PERFLUOROPOLYMER) (NO S/S DOCUMENT)
• IPC-FC241/14 – METAL-CLAD, FLEXIBLE, DIELECTRIC (ARAMID-PERFLUOROPOLYMER) (NO S/S DOCUMENT)
• IPC-FC241/15 – DIELECTRIC (POLYIMIDE-ACRYLIC), METAL-CLAD, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC241/16 – DIELECTRIC (POLYIMIDE-BUTYRAL PHENOLIC), METAL-CLAD, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC241/17 – DIELECTRIC (POLYIMIDE-EPOXY), METAL-CLAD, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC241/18 – DIELECTRIC (POLYIMIDE-CHEMICALLY DEPOSITED METAL-ADHESIVELESS), METAL-CLAD, FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC241/2 – DIELECTRIC (POLYIMIDE-EPOXY), METAL-CLAD FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC241/20 – DIELECTRIC (POLYIMIDE-CYANATE ESTER) FLEXIBLE METAL-CLAD (NO S/S DOCUMENT)
• IPC-FC241/3 – METAL-CLAD, FLEXIBLE, DIELECTRIC (FEP ACRYLIC) (NO S/S DOCUMENT)
• IPC-FC241/4 – METAL-CLAD, FLEXIBLE, DIELECTRIC (FEP EPOXY) (NO S/S DOCUMENT)
• IPC-FC241/5 – DIELECTRIC (POLYESTER-POLYESTER), METAL-CLAD FLEXIBLE (NO S/S DOCUMENT)
• IPC-FC241/7 – METAL-CLAD, FLEXIBLE, DIELECTRIC (EPOXY/POLYESTER FIBERS) (NO S/S DOCUMENT)
• IPC-FC241/8 – METAL-CLAD, FLEXIBLE, DIELECTRIC (EPOXY/GLASS/POLYESTER) (NO S.S DOCUMENT)
• IPC-FC241/9 – METAL-CLAD, FLEXIBLE, DIELECTRIC (EPOXY/GLASS) (NO S/S DOCUMENT)
• IPC-HDBK-001 – Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001B to C Comparison) (IPC-HDBK-001 with Amendment 1)
• IPC-J-STD-001 – Requirements for Soldered Electrical and Electronic Assemblies
• IPC-MF150 – METAL FOIL FOR PRINTED WIRING APPLICATIONS (NO S/S DOCUMENT)
• IPC-MF150/1 – METAL FOIL: COPPER, STANDARD ELECTRODEPOSITED (NO S/S DOCUMENT)
• IPC-MF150/2 – METAL FOIL: COPPER, HIGH DUCTILITY ELECTRODEPOSITED (NO S/S DOCUMENT)
• IPC-MF150/3 – METAL FOIL: COPPER, HIGH TEMPERATURE ELONGATION (NO S/S DOCUMENT)
• IPC-MF150/4 – METAL FOIL: COPPER, ANNEALED ELECTRODEPOSITED (NO S/S DOCUMENT)
• IPC-MF150/5 – METAL FOIL: COPPER, AS ROLLED-WROUGHT (NO S/S DOCUMENT)
• IPC-MF150/6 – METAL FOIL: COPPER, LIGHT COLD ROLLED-WROUGHT (NO S/S DOCUMENT)
• IPC-MF150/7 – METAL FOIL: COPPER, ANNEALED-WROUGHT (NO S/S DOCUMENT)